Villasmunta F.

Brandenburg University of Technology Cottbus-Senftenberg Cottbus, Germany; Technische Hochschule Wildau Wildau, Germany


IS02–Numerical Simulation of Optical Through-Silicon Waveguide for 3D Photonic Interconnections

Villasmunta F., Steglich P., Schrader S., Schenk H., Mai A.

Optical interconnections are a promising step forward to overcome the intrinsic limitations of electrical interconnections in integrated circuits. In this work, we present a finite element method (FEM) simulation study of a dielectric waveguide etched through the full thickness of a silicon substrate. In particular, it is investigated the effect of the bridge-to-core size ratio […]